Printed Circuit Board Manufacturing Capabilities

LAMINATES RoHS Compliant- EU Directive 2002\95\EC

NEMA FR-4 / IPC-4101/21/24/26
UL 796 DSR and 94V-0 Rated
External Base Copper - 0.25 to 3 oz
Internal Base Copper - 0.5 to 3.0 oz.

CTI >175
130^o - 170^oTg
Rogers - 4350B Series

STANDARD BOARD THICKNESSES & TOLERANCES

PER IPC-4101 Class B par. 3.8.4.2 (glass to glass)

BOARD FLATNESS
Per IPC-6012 par. 3.4.4

Surface Mount Product
All Other Product

0.75% of PCB diagonal measurement = 0.0075 inch / inch
1.5% of PCB diagonal measurement = 0.015 inch / inch

STANDARD CORE DIELECTRIC SELECTION
0.005", 0.008", 0.014", 0.021", 0.028" Other Sizes, Special Order

MAXIMUM NUMBER OF LAYERS

14 (Blind and Buried vias available)

MINIMUM FINISHED HOLE DIAMETER
Plated through holes = 0.006"
Nonplated through holes = 0.009"

FINISHED HOLE DIAMETER TOLERANCE FOR NONPLATED HOLES
PER IPC-2615

0.010 - 0.032"
0.033 - 0.063"
0.064 - 0.250"
Over 0.250"

Tol. = +/-0.002"
Tol. = +/-0.003"
Tol. = +/-0.004"
Tol. = +/-0.005"

FINISHED HOLE DIAMETER TOLERANCE FOR PLATED HOLES
PER IPC-2615

0.008 - 0.032"
0.033 - 0.063"
0.064 - 0.250"
Over 0.250"

Tol. = +/-0.003"
Tol. = +/-0.004"
Tol. = +/-0.005"
Tol. = +/-0.006"

INTERNAL SLOTS
Minimum - 0.031

KEYWAYS
Minimum - 0.031

QUALITY SYSTEM STANDARDS
ISO-9001-2008 Registered by QMI/ SAI GLOBAL

ACCECPTABILITY CRITERIA

IPC-A-600 (Latest revision) Clas 2 AND 3

PERFORMANCE SPECIFICATION

IPC-A-6012 (Latest revision) Clas 2 AND 3
UL 796,94V-0 File# E76719M (SEE PAGE 2)

CERTIFICATIONS AND REPORTS AVAILABLE

Base Laminates to IPC-4101
Microsection Evaluation
Thermal stress evaluation
Electrical Test to IPC-9252
Ionic Contamination to IPC-6012
Solderability to J-STD-003
X-ray Fluorescence and Capacitance plating thickness

EDAX, SEM by request
Impedance
AA Unit

SOLDERMASK TYPE

Liquid Photoimageable (LPI)
0.004" Minimum Solder Dam Web

IPC-SM-840 Class 2 and 3

ANNULAR RING REQUIREMENTS FOR SOLDERMASK
(TO ACHIEVE A NO MASK ON PADS CONDITION)

Liquid Photoimageable

MINIMUM ANNULAR RING = 0.003"

LAYER-TO-LAYER REGISTRATION
Films generated by Triangle CAM system = +/- 0.003"
Other films = +/- 0.005"

ANNULAR RING REQUIREMENTS
(TO ACHIEVE IPC-A-600 CLASS 3 - NO BREAKOUT) Minimum = 0.005"
(TO ACHIEVE IPC-A-600 CLASS 2 - 90 DEG. BREAKOUT) Minimum = 0.004"

HOLE LOCATION TOLERANCES
PER IPC-2615
12 inches or less = +/- 0.003"
Over12 inches = +/- 0.004"

LOCATION TOLERANCES FOR CUTOUTS, SLOTS AND NOTCHES
PER IPC-2615
12 INCHES OR LESS = +/- 0.006"
OVER 12 INCHES = +/- 0.008"

FINAL OUTSIDE BOARD DIMENSIONAL TOLERANCES
PER IPC-2615
+/- 0.005"

MINIMUM CONDUCTOR WIDTH / SPACE
(As measured on original film)

Line Width = 0.004" Space = 0.004"

MINIMUM SURFACE MOUNT PITCH = 0.015"

STANDARD PLATING THICKNESS
COPPER = 0.001" - 0.002"
SOLDER = Coverage and Solderable to J-STD-003
NICKEL = 50-200 micro inches
HARD GOLD = 30-80 micro inchesKnoop = 120 - 200
IMMERSION GOLD (ENIG) per IPC-4552 Knoop < 90
IMMERSION SILVER = per IPC-4553

ALTERNATIVE SURFACE COATINGS
Enthone OSP -ENTEK PLUS
Immersion White Tin
Immersion Gold (ENIG) and Hard Gold
Immersion Silver
Lead Free Hot Air Leveling (SN 100)

ELECTRICAL TEST CAPABILITIES
Gerber Netlist testing standard
Comparison to IPC-356A
Single or Dual sided simultaneous, fine pitch (15 mil) surface mount.

Everett Charles Trace 9090 dual grid Tester
Mania Flying Probe Tester
Mania Loc8 Flying Probe Tester

TEST RANGES

STANDARD

Continuity Resistance = 50 - 10K Ohm
Isolation Resistance = 0 - 100 Megohms
Voltages = 0 - 250 VDC

Controlled Impedance +/- 10%

50 Ohms
2M Ohms
100 VDC

THIS CHART REPRESENTS OUR STANDARD MANUFACTURING PROCESS CAPABILITIES AND TOLERANCES, TIGHTER TOLERANCES ARE AVAILABLE WITH PRIOR MANUFACTURING APPROVAL.